It's been little over a month since LeEco Le 1s made its debut in India. Now, a report has emerged that its successor Le 2 is under works.
Chinese technology blog My Drivers has got hold of Le 2 images showing the device from all angles. In the pictures, we see there is a stark difference between Le 2 and its predecessor in terms of design, especially on the rear.
Le 2 features a square fingerprint sensor and the company's brand graving below the biometric sensor now shows "LE" (simplified form of LeEco). Le 1S comes with a circular camera module and the brand engraving spells LeTV (the company's former name). The Le 2 is encased in a chamfered metal frame.
As far as internal hardware is concerned, Le 2 is expected to house either Qualcomm's Snapdragon 820 Quad-core SoC (System-on-Chip) or MediaTek's Helio X20 Deca-core processor backed by 4GB RAM.
It also expected to feature a much improved ultrasonic-based fingerprint sensor and a 21MP camera on the rear.
The leaked pictures of the Le 2 seem believable, but the device's internal specification casts doubts over the authenticity of the tipster. For instance, Snapdragon 820 is a very powerful processor. It is coming in Samsung Galaxy S7 series, LG G5, Xiaomi Mi 5 and other flagship phones slated to be released in 2016, so it is very unlikely a budget phone like the Le 2 will house such a CPU.
Readers are better off taking this report with the proverbial pinch of salt. Stay tuned for more updates.