Speculations around Apple's upcoming device dubbed as the iPhone 7 started barely after the iPhone 6s and 6s Plus hit stores. Some may find it weird but it is quite natural for a flagship device, especially if it is from Apple.
The iPhone 7 is expected to be released in September next year by the time the current flagship devices – the iPhone 6s and iPhone 6s Plus – complete one-year cycle in the market. Apple may not reveal the release date like in the past but it is obvious that it will come in the third quarter of 2016.
Planning and manufacturing of parts begins months before a device is released, so details are leaked at regular intervals even if mobile phone makers try to keep utmost secrecy. Several details of Apple's next-generation smartphone have also been leaked over the last few weeks.
Here are five things we know so far about the iPhone 7:
1) New Design: It is reported that the iPhone 7 will come with a new design. A section of the media has even claimed citing Apple's patent filing that the new device might sport a complete metal body or zero plastic.
2) Camera: The iPhone 6s has five-element lenses but the future iPhone is expected to have a superior camera – six-element lenses.
3) Slim Body: The iPhone 7 could be the slimmest iPhone when it is launched. According to a report by DigiTimes, analyst Ming-Chi Kuo of KGI Securities said in a note to investors that Apple is planning to make its upcoming iPhone, possibly the iPhone 7, between 6.0 and 6.5 mm thick.
4) Wireless Charging: Nothing is confirmed as of now but Apple patent application titled "Inductive Power Transfer Using Acoustic or Haptic Devices" has given a hint that its future devices could come with wireless charging feature. The upcoming iPhone 7 could be the device with this feature.
5) A10 Chip: The iPhone 7 could be powered by A10 chip. According to Geek, Apple has ordered for parts of iPhone 7 and mass production of processor could start in March next. It claimed that Taiwan Semiconductor Manufacturing Company (TSMC) has secured exclusive supply contract of chips.