LeEco, formerly known as LeTV, set a new trend in February by introducing Qualcomm Snapdragon 820 processor for the first time in the Le Max Pro, following which the likes of Samsung, Xiaomi, LG, HTC and others used the chip for their high-end handsets. Now, the company is said to be raising the bar yet again through its upcoming device believed to be named LeEco Le Max 2 Pro.
According to reports, LeEco will announce the Le Max 2 Pro on June 29. GadgetArena (via GSMArena) has reported that the Chinese company is coming out with a new device codenamed LEX720 and it has been leaked on AnTuTu benchmark. The handset is expected to be unveiled along with the Le Max 2 Pro next week.
The yet-to-be-named device has been spotted on AnTuTu with a 4 GB RAM, a 1,440x2,560 pixels (QHD) screen resolution, an Android 6.0.1 Marshmallow operating system, a 16MP main camera, an 8MP front-snapper, and a Qualcomm MSM8996pro, which is believed to be the codename for Qualcomm Snapdragon 823. It is not a device from the Max line in most probability, as the Le Max Pro comes packed with a 6GB RAM and the company is very unlikely to downgrade it to 4GB RAM for its successor.
Meanwhile, GizmoChina had earlier reported that LeEco is set to release a new device (believed to be the Le Max 2 Pro) at the upcoming Mobile World Congress at Shanghai, which is starting on July 29. The handset is expected to be powered by a Qualcomm Snapdragon 823 processor, come packed with an 8GB RAM and mount a 25MP camera.