Chinese consumer electronics major LeEco, formerly known as LeTV, launched a new line of smartphones -- Le 2, 2 Pro and Max 2 -- in Beijing on April 20. Now, the Indian arm of the company has begun sending out invites for an event in Mumbai on May 3.
"Block your date to witness the revolution, Entertainment will play in a whole new way"-- reads LeEco's invitation (courtesy, BGR India).
Though the company does not directly mention the significance of the event, the cryptic message does hint that LeEco might release the newly unveiled Le 2 and Max 2 series phones in India as they are the world's first devices to boast new USB Type-C headphone port with Continual Digital Lossless Audio (CDLA) noise cancelling standard for enhanced music hearing experience. It also doubles up as a charging port.
Apple's iPhone 7, which is rumoured to make its debut in September, is also expected to boast similar advanced headphone-cum-charging port technology.
Watch this space for more updates.
Key features of LeEco Le 2, 2 Pro and Max 2:
|Models||LeEco Le 2||LeEco Le 2 Pro||LeEco Le Max 2|
|Display||5.5-inch full HD (1920x1080p) IPS screen
||5.5-inch full HD (1920x1080p) IPS screen
||5.7-inch Quad HD (2560x1440p) screen
|OS||Android 6.0 Marshmallow-based EUI 5.8||Android 6.0 Marshmallow-based EUI 5.8||Android 6.0 Marshmallow-based EUI 5.8|
|Processor||64-bit class 2.3GHz MediaTek Helio X20 deca-core CPU||64-bit class MediaTek Helio X25 deca-core CPU||64-bit class 2.15GHz Qualcomm Snapdragon 820 quad-core CPU|
|GPU||Mali-T880 MP4||Mali-T880 MP4||Adreno 530|
|RAM||3GB LPDDR3||3GB LPDDR3||LPDDR4 series 4GB/6GB|
|Storage||32GB (eMMC5.1)||32GB (eMMC5.1)||32GB/64GB â€“ USF v2.0 (eMMC5.1)|
|Battery||3,000mAh battery with LeEco fast charging technology||3,000mAh battery with LeEco fast charging technology||3,100mAh battery with Qualcomm Quick Charge v3.0 technology|
|Add-ons||Fingerprint sensor, dual-SIM slots (nano+nano), CDLA loss-less audio, Dolby Atmos, infrared sensor, Type C USB port, Bluetooth v4.2, Wi-Fi (a/b/g/n/ac; dual-band: 2.4GHz/5GHz),||Fingerprint sensor, dual-SIM slots (nano+nano), CDLA loss-less audio, Dolby Atmos, infrared sensor, Type C USB port, Bluetooth v4.2, Wi-Fi (a/b/g/n/ac; dual-band: 2.4GHz/5GHz),||Qualcomm's Sense ID ultrasonic fingerprint sensor, dual-SIM slots (nano+nano), CDLA loss-less audio, Dolby Atmos, infrared sensor, Type C USB port, Bluetooth v4.2, Wi-Fi (a/b/g/n/ac; dual-band: 2.4GHz/5GHz) with MIMO|
|Dimensions||151.1 Ã— 74.2 Ã— 7.5 mm||151.1 Ã— 74.2 Ã— 7.5 mm||156.8 Ã— 77.6 Ã— 7.99 mm|
|Weight||153 g||153 g||185 g|
|Price (in China)||Â¥1,100 ($170/â‚¬150/Rs. 11,200).||Â¥1,500 ($230/â‚¬205/Rs. 15,350)||