LeEco Le Max 2, Le 2 Pro and Le 2 launched in China with USB Type-C headphones and no 3.5mm jack
[Representative Image] LeEco Le 2, 2Pro, Max2 tipped to be released in India next month. Pictured: LeEco Le Max 2, Le 2 Pro and Le 2 launched in China with USB Type-C headphones and no 3.5mm jackFacebook/LeEco

Chinese consumer electronics major LeEco, formerly known as LeTV, launched a new line of smartphones -- Le 2, 2 Pro and Max 2 -- in Beijing on April 20. Now, the Indian arm of the company has begun sending out invites for an event in Mumbai on May 3.

"Block your date to witness the revolution, Entertainment will play in a whole new way"-- reads LeEco's invitation (courtesy, BGR India).

Though the company does not directly mention the significance of the event, the cryptic message does hint that LeEco might release the newly unveiled Le 2 and Max 2 series phones in India as they are the world's first devices to boast new USB Type-C headphone port with Continual Digital Lossless Audio (CDLA) noise cancelling standard for enhanced music hearing experience. It also doubles up as a charging port. 

Apple's iPhone 7, which is rumoured to make its debut in September, is also expected to boast similar advanced headphone-cum-charging port technology.

Read more: Apple iPhone 7 to ditch 3.5 mm audio jack in favour of Type C USB port

Watch this space for more updates.

Key features of LeEco Le 2, 2 Pro and Max 2:

Models LeEco Le 2 LeEco Le 2 Pro LeEco Le Max 2
Display 5.5-inch full HD (1920x1080p) IPS screen
  • Brightness: 500 nits
  • Pixel density: 403 ppi (pixels per inch)
5.5-inch full HD (1920x1080p) IPS screen
  • Brightness: 500 nits
  • Pixel density: 403 ppi (pixels per inch)
5.7-inch Quad HD (2560x1440p) screen
  • Brightness: 450 nits
  • Pixel density: 538 ppi (pixels per inch)
OS Android 6.0 Marshmallow-based EUI 5.8 Android 6.0 Marshmallow-based EUI 5.8 Android 6.0 Marshmallow-based EUI 5.8
Processor 64-bit class 2.3GHz MediaTek Helio X20 deca-core CPU 64-bit class MediaTek Helio X25 deca-core CPU 64-bit class 2.15GHz Qualcomm Snapdragon 820 quad-core CPU
GPU Mali-T880 MP4 Mali-T880 MP4 Adreno 530
RAM 3GB LPDDR3 3GB LPDDR3 LPDDR4 series 4GB/6GB
Storage 32GB (eMMC5.1) 32GB (eMMC5.1) 32GB/64GB – USF v2.0 (eMMC5.1)
Camera
  • Main: 16MP camera with dual-tone LED flash, PDAF (Phase Detection Auto Focus), f/2.0 aperture
  • Front: 8MP camera with 76.5-degree wide-angle lens, 1.4μm pixel size, f/2.2 aperture
  • Main: 21MP camera with Sony IMX230 sensor, dual-tone LED flash, 6-Physocal lens, PDAF (Phase Detection Auto Focus), f/2.0 aperture
  • Front: 8MP camera with 76.5-degree wide-angle lens, 1.4μm pixel size, f/2.2 aperture
  • Main: 21MP camera with Sony IMX230 sensor, dual-tone LED flash, 6-Physocal lens, PDAF (Phase Detection Auto Focus), f/2.0 aperture
  • Front: 8MP camera with 76.5-degree wide-angle lens, 1.4μm pixel size, f/2.2 aperture
Battery 3,000mAh battery with LeEco fast charging technology 3,000mAh battery with LeEco fast charging technology 3,100mAh battery with Qualcomm Quick Charge v3.0 technology
Network 4G-LTE 4G-LTE 4G-LTE
Add-ons Fingerprint sensor, dual-SIM slots (nano+nano), CDLA loss-less audio, Dolby Atmos, infrared sensor, Type C USB port, Bluetooth v4.2, Wi-Fi (a/b/g/n/ac; dual-band: 2.4GHz/5GHz), Fingerprint sensor, dual-SIM slots (nano+nano), CDLA loss-less audio, Dolby Atmos, infrared sensor, Type C USB port, Bluetooth v4.2, Wi-Fi (a/b/g/n/ac; dual-band: 2.4GHz/5GHz), Qualcomm's Sense ID ultrasonic fingerprint sensor, dual-SIM slots (nano+nano), CDLA loss-less audio, Dolby Atmos, infrared sensor, Type C USB port, Bluetooth v4.2, Wi-Fi (a/b/g/n/ac; dual-band: 2.4GHz/5GHz) with MIMO
Dimensions 151.1 × 74.2 × 7.5 mm 151.1 × 74.2 × 7.5 mm 156.8 × 77.6 × 7.99 mm
Weight 153 g 153 g 185 g
Price (in China) ¥1,100 ($170/€150/Rs. 11,200). ¥1,500 ($230/€205/Rs. 15,350)
  • 32GB: ¥2,100 ($325/€287/Rs. 21,490);
  • 64GB: ¥ 2,500 ($385/€342/Rs. 25,490)
Also read